| 1971
Sep. |
Establishment of Japan Pure Chemical CO., LTD.
(capitalization of ¥1,000,000) for the development, sales and
manufacture of chemicals for precious metal plating. |
| 1972
Feb. |
Development of high purity gold plating chemicals
for semiconductors. |
| 1974
Apr. |
Development of high purity gold plating chemicals
for connectors and printed circuit boards. |
| 1975
May. |
Development of high purity silver plating
chemicals for semiconductors. |
| 1983
Jun. |
Development of high purity gold plating chemicals
for
aluminum wire bonding. |
| 1984
Jan. |
Development of cyan-free gold plating chemicals
for semiconductors. |
| 1985
Sep. |
Development of palladium plating chemicals for
connectors. |
| 1988
Feb. |
Development of electroless gold plating chemicals. |
| 1999
Nov. |
Implementation of MBO (capitalization of ¥813,000,000) |
| 2001
May |
Development of selective cupper adsorption process. |
| 2001
Dec. |
Capitalization increased to ¥955,500,000 |
| 2002
Jul. |
Development of direct immersion gold plating
chemicals
14 for 1 stock split |
| 2002
Dec. |
JASDAQ market listing
Capitalization increased to ¥1,134,000,000. |
| 2003
May |
Development of auto catalytic gold plating chemical. |
| 2004
Mar. |
Listing on TSE Second Section. |
| 2004
May |
2 for 1 stock split |
| 2005
Mar. |
Listing on TSE First Section. |
| 2005
Apr. |
Achievement of ISO 9001 and 14001 certification. |
| 2006
Apr. |
2 for 1 stock split. |
