JAPAN PURE CHEMICAL : Corporate Information

The requirement of a precious metal plating solution is to provide coating that is highly reliable and sustainable between components at the time of installation. We established this requirement as a basic policy for the R&D themes of the Company, thereby addressing social
demand.
Plating solutions used for precious metal plating experiments were sorted according to the type of precious metal (e.g., cyan gold, cyan-free gold, cyan silver, cyan-free silver, palladium, nickel, copper), treated either by wastewater treatment equipment or outsourced according to density.

R&D Process

To address a recent global environmental concern, a shift to lead-free products is being strongly promoted and disseminated internationally. Solder used to connect electronic components contains lead at a ratio as high as 38%, which is hazardous to the human body and the environment. Discontinuing the use of solder containing lead has been highly recommended, and the EU has enforced the Restriction of Hazardous Substances (RoHS), which prohibits the sale of electrical and electronic equipment that contains lead effective from July 2006.
To address such a trend, the Company provides gold plating chemicals that are chemically stable and do not generate whiskers, whisker-like substances generated on lead-free solder that could cause short circuits between terminals. The Company uses electroless plating technology that provides sufficient sustainable bond strength and reliability despite the use of lead-free solder, aiming to eliminate the gap between the global environmental issues and demand from the electronics industry.

IC Package Improve solder bond strength

As an electroless plating technology used for IC packages, the Company currently supplies two kinds of gold plating chemicals—Direct Immersion Gold (DIG) and Electroless Nickel Immersion Gold (ENIG), both electroless plating solutions that feature excellent anticorrosive capabilities on the surface metal of terminals as well as satisfactory and reliable bond strength despite the use of lead-free solder.