Gold Plating Series Temperesist Series Temperesist is mainly used for semiconductor to prepare high purity gold deposit. Obtained surface is stable under high temperature and shows 60 to 80HV hardness, suitable for wire-bonding. Temperesist satisfies MIL G-45204C typeIII requirement. Orobright Series Orobright is mainly used for connector and PCB to prepare gold-cobalt alloy deposit with excellent plating speed. Obtained surface is bright with homogeneous coating thickness, resists against erosion and abrasion, shows good solderbility. Orobright satisfies MIL G-45204C typeI requirement. IM-Gold series IM-Gold is electroless gold plating formulation used to prepare semi-bright gold deposit. Strong adhesion between deposited layer and substrate gives suitable surface for soldering and wire-bonding. Silver Plating Series Temperesist AGR Series Temperesist AGR is electroplating formulation that deposits high purity(99.99%) silver, mainly used for semiconductor. Plated surface is adjustable to non bright white or semi bright or bright with surface hardness of 80-100HV. It shows strong resistance against acid and excellent solderbility. IM-Silver series IM-Silver is an electroless plating formulation that deposits silver on copper surface. The formulation doesn't include cyanide compounds and prepares silver plated surface that shows excellent solderbility. Palladium Plating Series Pallabright Series Pallabright is palladium plating formulation used both for electronic parts (connector, PCB, lead frame, etc.), and watch decoration. Obtained palladium layer is resistant against crack that was frequently observed in the past. Others Stripper 4 types of Stripper formulation are used to peel off deposited layer of gold, silver, copper and palladium at room temperature. Preservative These formulation are used to prevent rust or discoloration after plating.