Electrolytic plating, in which current is applied through a conductive circuit embedded inside an electronic device, is limited in terms of its future capability to respond to increasingly higher densities. Accordingly, greater importance is being accorded to electroless plating that does not require conductive circuitry.

Electroless plating technology is applicable not only to gold, but also to palladium and silver. Various plating thicknesses are required, ranging from the micron to the nano level, which correspond to different bonding methods such as bumps, wires, and soldering.

Electroless chemicals include molecules that generate electrons by means of a chemical reaction as a substitute for the electric current in electro-plating. The molecular structures of these compounds, which are also known as chemical power supplies, as well as the reaction control mechanisms, are highly important fundamental technologies that lie on the border between electronics and chemistry.

Japan Pure Chemical specializes in precious metal plating chemicals for electrical equipment that incorporate gold, palladium, and silver, and our market share for high-end electronic components such as semiconductor mounting substrates and printed circuit boards is strengthening. We currently supply two types of gold plating chemicals that utilize electroless plating technology for semiconductor mounting substrates, known as Direct Immersion Gold (DIG) and Electroless Nickel Immersion Gold (ENIG), both of which feature excellent anti-corrosive capabilities and satisfactory bond strength.