The
strength and reliability of solder ball joints can be measured.
This
plating device, which is used to fusion-bond soldering balls onto
substrates under heated conditions, is available in an atmospheric
pressure or a nitrogen atmosphere.
This
equipment can make samples that are appropriate for processing and
observing the cross-section structure of a substance by etching the
plated surface with ion beams. It can be used to observe alloy layers
and voids that are generated at the boundary face between each soldering
ball and the plated face.
This
scanning electron microscope conducts high-definition shape measurements
using electrochemical discharge-type electrons. The detector element
can accommodate both secondary and reflection electrons, and is equipped
with an EDX (energy dispersive X-ray) spectrometer. The microscope
enables us to observe diameters of nano-order particles of precious
metal plated substances and conduct elementary analysis of the plated
cross-sections processed with focused ion beams.
An
IR-spectrometer (Avatar370) and IR-microscope (Continuum) are combined
to analyze tiny (micron-diameter) particles attached to the plated
surface.
This
plasma spectroscope can be used to analyze specified volumes of minute
impurities contained in solutions such as plating liquid. Higher sensitivity
can be ensured compared with an ordinary atomic absorption analysis
because samples are atomized or ionized in a high-temperature plasma
environment; even PSB chemicals can be analyzed and the apparatus
is less vulnerable to coexisting elements due to its vacuum system;
and accurate determination is available at the ppm level via a 2-channel
internal standard method.
This
machine is useful for analyzing the crystal structure and orientation
of plated metal layers.
This
machine determines ion species dissolved in a plating formulation
by separating each species with electrophoresis mechanism.
This
X-ray analyzer enables film-pressure measurements and qualitative
analysis for adjacent elements at a high precision level. It is
also capable of percentage measurements of Pd-Ni alloys.
Surface
analysis within a 50A depth range is possible. Depth profile analysis
is also possible within a 5E depth using the Ar sputter attachment.
Plating
tests are conducted in a draft room equipped with plating bath, temperature
controller, power supplier, potentiostat, pH meter, flow meter, stirrer
and filter. Waste water and gas are collected and purified to minimize
pollution.
The
strength and reliability of solder ball joints can be measured.
This
plating device, which is used to fusion-bond soldering balls onto
substrates under heated conditions, is available in an atmospheric
pressure or a nitrogen atmosphere.
This
equipment can make samples that are appropriate for processing and
observing the cross-section structure of a substance by etching the
plated surface with ion beams. It can be used to observe alloy layers
and voids that are generated at the boundary face between each soldering
ball and the plated face.
This
scanning electron microscope conducts high-definition shape measurements
using electrochemical discharge-type electrons. The detector element
can accommodate both secondary and reflection electrons, and is equipped
with an EDX (energy dispersive X-ray) spectrometer. The microscope
enables us to observe diameters of nano-order particles of precious
metal plated substances and conduct elementary analysis of the plated
cross-sections processed with focused ion beams.
An
IR-spectrometer (Avatar370) and IR-microscope (Continuum) are combined
to analyze tiny (micron-diameter) particles attached to the plated
surface.
This
plasma spectroscope can be used to analyze specified volumes of minute
impurities contained in solutions such as plating liquid. Higher sensitivity
can be ensured compared with an ordinary atomic absorption analysis
because samples are atomized or ionized in a high-temperature plasma
environment; even PSB chemicals can be analyzed and the apparatus
is less vulnerable to coexisting elements due to its vacuum system;
and accurate determination is available at the ppm level via a 2-channel
internal standard method.
This
machine is useful for analyzing the crystal structure and orientation
of plated metal layers.
This
machine determines ion species dissolved in a plating formulation
by separating each species with electrophoresis mechanism.
This
X-ray analyzer enables film-pressure measurements and qualitative
analysis for adjacent elements at a high precision level. It is
also capable of percentage measurements of Pd-Ni alloys.
Surface
analysis within a 50A depth range is possible. Depth profile analysis
is also possible within a 5E depth using the Ar sputter attachment.
Plating
tests are conducted in a draft room equipped with plating bath, temperature
controller, power supplier, potentiostat, pH meter, flow meter, stirrer
and filter. Waste water and gas are collected and purified to minimize
pollution.