We are committed to continually improving and expanding our technical development team and growing into a fine chemical company.
How were the business results for the fiscal half-year?
The Company continued to enjoy favorable conditions, supported by robust demand for electronic components. Sales of pure gold plating chemicals for wire bonding were robust, supported by replacement demand for personal computers and by demand for semiconductors used in memory. Electroless plating chemicals for package substrates and smartphones were strong, and as smartphone functionality has improved, our technological advantage has resulted in solid performance. In palladium plating chemicals for lead frames, the high market price for palladium since last year has caused concern among customers, and led to a trend of slowing in sales volumes.
As a result, the Company recorded net sales of ¥5,498 million, an increase of 9.3% year on year, operating profit of ¥550 million, a decline of 0.2% year on year, ordinary profit of ¥626 million, an increase of 3.8% year on year, and profit of ¥455 million, an increase of 7.8% year on year.
The breakdown of sales by final products was ¥2,005 million from printed circuit boards and semiconductor substrates, ¥960 million from connectors and micro switches, ¥2,419 million from lead frames and ¥113 million from others.