- Electrolytic Silver
- Electrless Silver
- Anti Bacterial Agent
- Impurity Removal
- Other Surface Treatment Chemicals
- Stripping Agent
Electrolytic Silver
The TEMPERESIST AGR and SELENABRIGHT Series are high-speed silver plating formulations that provide pure silver coatings.
The electrodeposit has a wide color tone from dull-white to bright and shows excellent wire bonding and soldering properties.
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TEMPERESIST AGR Series
Application/CharacteristicsLeadframe use
- Ag conc.60g/L
- Temp.60℃
- pHNeutral
- Current Density*10~220A/dm2
- Hardness80~100HV
- Brightnessdull~1.0以上
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SELENABRIGHT N50
Application/CharacteristicsRack plating.Low cyanide.
- Ag conc.50g/L
- Temp.40℃
- pHNeutral
- Current Density*5~12A/dm2
- Hardness80~100HV
- Brightness0.5~0.8以上
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SELENABRIGHT C
Application/CharacteristicsRack plating and hoop plating.Cyanide type.
- Ag conc.50g/L
- Temp.40℃
- pHAlkaline
- Current Density*10~40A/dm2
- Hardness80~130HV
- Brightness0.5~0.8以上
Electrless Silver
IM-SILVER is a non-cyanide immersion silver plating formulation on Cu surfaces.
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IM-SILVER TK
Application/CharacteristicsSuitable for soldering as alternation of solder leveling or Ni/Au plating processes.
- Ag conc.1g/L
- Temp.45℃
- pHNeutral
Anti Bacterial Agent
Applicable to plating tanks and drag-out tanks. Suppresses growth of microorganisms without sacrificing plating performance.
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MFP Anti Bacterial Agent Series
Application/CharacteristicsSuppresses growth of microorganisms. Applicable plating chemicals are limited.
Impurity Removal
JPR 2001 is a Cu removal resin that selectively removes Cu ions dissolved in Au and Pd bath solutions. JPR 2001 can be reused by desorbing absorbed Cu ions. FINEGARD is an activated carbon filter applicable to JPC plating chemicals.
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JPR2001
Applicable Plating Chemicals TEMPERESIST (EX, FX, BL), PALLABRIGHT (SST, SST-L, NANO2), OROBRIGHT, etc.
- Target ImpurityCu
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AC CARTRIDGE FILTER UPT065
Applicable Plating ChemicalsTEMPERESIST (EX, FX, BL), PALLABRIGHT (SST, SST-L), OROBRIGHT BAR Series.
- Target ImpurityOrganic Impurities
Other Surface Treatment Chemicals
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PREDIP T99
Application/CharacteristicsImmersion inhibitor on Cu and Ni surfaces. Inhibits surface oxidation and sulfidation and maintains activated surfaces for excellent adherence.
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PREDIP AGR(C)
Application/CharacteristicsImmersion inhibitor on Cu and Ni surfaces. Inhibits surface oxidation and sulfidation and maintains activated surfaces for excellent adherence.
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COPPER PROTECTOR T45
Application/CharacteristicsAnti discoloration agent for Cu surfaces and has excellent heat resistance. Used after electrolytic stripping of Ag coating on leadframes.
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AQUA PRECOAT
Application/CharacteristicsWater-soluble sealing agent. Applicable to Au and Ag surfaces. Improves corrosion resistance.
Stripping Agent
STRIPPER is a high-speed stripping agent usable at room temperature.
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STRIPPER GOLD
Application/CharacteristicsHigh-speed immersion Au stripper with cyanide.
- TypeAu
- pHAlkaline
- Current Density-
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STRIPPER PALLADIUM
Application/CharacteristicsImmersion Pd stripper with cyanide.
- TypePd
- pHAlkaline
- Current Density-
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SUPER STRIPPER
Application/CharacteristicsHigh-speed immersion Ag and Cu stripper with cyanide.
- TypeAg,Cu
- pHAlkaline
- Current Density-
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SILVER STRIPPER D23SS Series
Application/CharacteristicsNon-cyanide electrolytic Ag stripper.
- TypeAg
- pHSlightly Alkaline
- Current Density0.2~3.9A/dm2