Proprietary technology for a brighter future
Japan Pure Chemical CO.,LTD. (the Company) is primarily engaged in the development, manufacture and sale of chemicals for the noble metal plating of contacts and connectors for the attachment of electronic components on printed circuit boards (including package substrates), and for connectors and lead frames. The Company is particularly skilled in the provision of comprehensive proposals that extend to advice on processes and after-sales services. This makes possible the development, manufacture and sale of products that closely match the needs of customers.
Since its establishment in July 1971, the Company has consistently targeted the electronics industry. As a result, the Company has grown along with this industry through the provision of gold plating chemicals for semiconductor packages and connectors, silver plating chemicals, and palladium plating chemicals. When developing new products, the Company employs internal resources rather than relying on the adoption of technology from overseas, a stance that has resulted in the accumulation over many years of a storehouse of technology.
Types of Functional Plating and Their Usage
Soft gold plating
Electrolytic Bath operating with less Au content used for wire-bonding connection of IC packages
Hard gold plating(gold alloy)
Used for contacting connections of connectors and the like BAR7 for fine connectors
Lead frame application NANO2 for ultra-thin PPF plating
Used for ACF connection and soldering for mobile phone circuit boards
IB2 IB2X OM for smart phone circuit boards
Auto catalytic plating
NEO GOLD Series
Used for servers and desktop PCs MPU package NEOGOLD-PN