Electrolytic Soft Gold
TEMPERESIST is a high purity (99.99% ) gold electroplating formulation for semiconductor applications.
The electrodeposit has a lemon yellow surface and achieves a hardness of ca. 70 HV, making it ideal for wire bonding.
Combining TEMPERESIST with "JPR 2001" (a Cu removal resin) extends the bath lifetime and contributes to cost reduction.
Cyanide Type
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TEMPERESIST EX
Application/CharacteristicsProven results for BGA and CSP.
- Au conc.8g/L
- Temp.65℃
- pHNeutral
- Current Density*0.2~0.6A/dm2
- Hardness60~80HV
- Purity99.99%
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TEMPERESIST FX
Application/CharacteristicsHigh-speed plating formulation. Directly applicable to Cu surfaces. Proven results for FPC.
- Au conc.5g/L
- Temp.65℃
- pHNeutral
- Current Density*0.2~1.0A/dm2
- Hardness60~80HV
- Purity99.99%
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TEMPERESIST BL
Application/CharacteristicsBarrel plating. Applicable to pin plating for PGA.
- Au conc.5g/L
- Temp.65℃
- pHNeutral
- Current Density*0.05~1.0A/dm2
- Hardness60~80HV
- Purity99.99%
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TEMPERESIST GR
Application/CharacteristicsNon-erosive to resist. Coreless PCBs.
- Au conc.3g/L
- Temp.65℃
- pHSlightly acidic
- Current Density*0.1~0.4A/dm2
- Hardness60~80HV
- Purity99.99%
Non-cyanide Type
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TEMPERESIST K91 Series
Application/CharacteristicsLow stress gold coating.
- Au conc.10g/L
- Temp.65℃
- pHNeutral
- Current Density*0.2~0.6A/dm2
- Hardness80~120HV
- Purity99.99%
Electrolytic Hard Gold
OROBRIGHT is a gold electroplating formulation for PWB, connector, contact and soldering uses. It enables low stress gold alloy plating without cracks or peeling. The electrodeposit shows a high corrosion resistance, low contact resistance and excellent solder wettability.
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OROBRIGHT HS2
Application/CharacteristicsAu-Co alloy.High throwing power. Rack plating.
- Au conc.2g/L
- Temp.42℃
- pHSlightly acidic
- Current Density*0.5~3.0A/dm2
- Hardness180~210HV
- Purity99.7~99.99%
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OROBRIGHT HS5
Application/CharacteristicsAu-Co alloy.Submerged jet plating and jet plating.
- Au conc.5g/L
- Temp.42℃
- pHSlightly acidic
- Current Density*1~60A/dm2
- Hardness180~210HV
- Purity99.7~99.99%
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OROBRIGHT HS10
Application/CharacteristicsAu-Co alloy.Jet plating.
- Au conc.10g/L
- Temp.50℃
- pHSlightly acidic
- Current Density*10~70A/dm2
- Hardness180~210HV
- Purity99.7~99.99%
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OROBRIGHT HSB Series
Application/CharacteristicsAu-Co alloy.Barrel plating.
- Au conc.2g/L
- Temp.42℃
- pHSlightly acidic
- Current Density*0.02~3.0A/dm2
- Hardness160~210HV
- Purity99.7~99.99%
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OROBRIGHT KS
Application/CharacteristicsAu-Co alloy.Non-erosive to resist
- Au conc.8g/L
- Temp.35℃
- pHSlightly acidic
- Current Density*0.5~1.5A/dm2
- Hardness180~210HV
- Purity99.7~99.99%
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OROBRIGHT SOL
Application/CharacteristicsAu-Ni alloy.Rack plating and jet plating.
- Au conc.10g/L
- Temp.42℃
- pHSlightly acidic
- Current Density*1~60A/dm2
- Hardness150~180HV
- Purity99.96~99.98%
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OROBRIGHT GA
Application/CharacteristicsAu-Ag alloy.Jet plating.
- Au conc.15g/L
- Temp.60℃
- pHNeutral
- Current Density*1~25A/dm2
- Hardness95~110HV
- Purity99.2~99.5%
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OROBRIGHT BAR Series
Application/CharacteristicsAu-Co alloy.Jet plating with Ni barrier.
- Au conc.5g/L~
- Temp.50℃
- pHSlightly acidic
- Current Density*10~60A/dm2
- Hardness160~210HV
- Purity99.70~99.98%
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OROBRIGHT BAR(NI)Series
Application/CharacteristicsAu-Ni alloy.Jet plating with Ni barrier.
- Au conc.5g/L~
- Temp.50℃
- pHSlightly acidic
- Current Density*10~60A/dm2
- Hardness160~200HV
- Purity99.70~99.98%
Strike Gold and Flash Gold
ACID STRIKE is a strike gold plating formulation that enhances the adherence of plated coatings.
AFTER PLATE is a flash gold plating formulation for leadframe use.
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ACID STRIKE
Application/CharacteristicsStrike plating.Barrel plating and rack plating.
- Au conc.1.0g/L
- Temp.30℃
- pHSlightly acidic
- Current Density*1~5A/dm2
- Purity99.99%
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ACID STRIKE SS
Application/CharacteristicsStrike plating on SUS surfaces.Rack plating.
- Au conc.1.0g/L
- Temp.32℃
- pHAcidic
- Current Density*(4~7V)
- Purity99.99%
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AFTER PLATE
Application/CharacteristicsProven results for leadframe use.
- Au conc.0.5g/L
- Temp.50℃
- pHNeutral
- Current Density*0.05~0.10A/dm2
- Purity99.99%
Electroless Gold
IM-GOLD provides a pure gold coating with a dull surface finish.
The deposit shows high corrosion resistance and strong adherence suitable for soldering and wire bonding.
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IM-GOLD IB
Application/CharacteristicsImmersion gold plating on middle-P Ni surface. Suitable for soldering.
- Au conc.2.0g/L
- Temp.80℃
- pHSlightly acidic
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IM-GOLD IB2X
Application/CharacteristicsImmersion gold plating on both high-P Ni and middle-P Ni surfaces. High corrosion resistance and excellent soldering property.
- Au conc.1.2g/L
- Temp.80℃
- pHNeutral
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IM-GOLD CN Series
Application/CharacteristicsImmersion gold plating on middle-P Ni surfaces. Excellent soldering properties.
- Au conc.1.0g/L
- Temp.70℃
- pHNeutral
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IM-GOLD PC
Application/CharacteristicsImmersion gold plating on Cu surfaces.Excellent soldering properties
- Au conc.2.0g/L
- Temp.85℃
- pHNeutral
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NEO GOLD Series
Application/CharacteristicsNon-cyanide autocatalytic gold plating formulation with high stability.Suitable for soldering and wire bonding.
- Au conc.2.0g/L
- Temp.65℃
- pHNeutral