Electrolytic Soft Gold

TEMPERESIST is a high purity (99.99% ) gold electroplating formulation for semiconductor applications.
The electrodeposit has a lemon yellow surface and achieves a hardness of ca. 70 HV, making it ideal for wire bonding.
Combining TEMPERESIST with "JPR 2001" (a Cu removal resin) extends the bath lifetime and contributes to cost reduction.

Cyanide Type

  • TEMPERESIST EX

    Application/CharacteristicsProven results for BGA and CSP.

    • Au conc.8g/L
    • Temp.65℃
    • pHNeutral
    • Current Density*0.2~0.6A/dm2
    • Hardness60~80HV
    • Purity99.99%
  • TEMPERESIST FX

    Application/CharacteristicsHigh-speed plating formulation. Directly applicable to Cu surfaces. Proven results for FPC.

    • Au conc.5g/L
    • Temp.65℃
    • pHNeutral
    • Current Density*0.2~1.0A/dm2
    • Hardness60~80HV
    • Purity99.99%
  • TEMPERESIST BL

    Application/CharacteristicsBarrel plating. Applicable to pin plating for PGA.

    • Au conc.5g/L
    • Temp.65℃
    • pHNeutral
    • Current Density*0.05~1.0A/dm2
    • Hardness60~80HV
    • Purity99.99%
  • TEMPERESIST GR

    Application/CharacteristicsNon-erosive to resist. Coreless PCBs.

    • Au conc.3g/L
    • Temp.65℃
    • pHSlightly acidic
    • Current Density*0.1~0.4A/dm2
    • Hardness60~80HV
    • Purity99.99%
*Depends on Au concentration and agitation conditions.

Non-cyanide Type

  • TEMPERESIST K91 Series

    Application/CharacteristicsLow stress gold coating.

    • Au conc.10g/L
    • Temp.65℃
    • pHNeutral
    • Current Density*0.2~0.6A/dm2
    • Hardness80~120HV
    • Purity99.99%
*Depends on Au concentration and agitation conditions.

Electrolytic Hard Gold

OROBRIGHT is a gold electroplating formulation for PWB, connector, contact and soldering uses. It enables low stress gold alloy plating without cracks or peeling. The electrodeposit shows a high corrosion resistance, low contact resistance and excellent solder wettability.

  • OROBRIGHT HS2

    Application/CharacteristicsAu-Co alloy.High throwing power. Rack plating.

    • Au conc.2g/L
    • Temp.42℃
    • pHSlightly acidic
    • Current Density*0.5~3.0A/dm2
    • Hardness180~210HV
    • Purity99.7~99.99%
  • OROBRIGHT HS5

    Application/CharacteristicsAu-Co alloy.Submerged jet plating and jet plating.

    • Au conc.5g/L
    • Temp.42℃
    • pHSlightly acidic
    • Current Density*1~60A/dm2
    • Hardness180~210HV
    • Purity99.7~99.99%
  • OROBRIGHT HS10

    Application/CharacteristicsAu-Co alloy.Jet plating.

    • Au conc.10g/L
    • Temp.50℃
    • pHSlightly acidic
    • Current Density*10~70A/dm2
    • Hardness180~210HV
    • Purity99.7~99.99%
  • OROBRIGHT HSB Series

    Application/CharacteristicsAu-Co alloy.Barrel plating.

    • Au conc.2g/L
    • Temp.42℃
    • pHSlightly acidic
    • Current Density*0.02~3.0A/dm2
    • Hardness160~210HV
    • Purity99.7~99.99%
  • OROBRIGHT KS

    Application/CharacteristicsAu-Co alloy.Non-erosive to resist

    • Au conc.8g/L
    • Temp.35℃
    • pHSlightly acidic
    • Current Density*0.5~1.5A/dm2
    • Hardness180~210HV
    • Purity99.7~99.99%
  • OROBRIGHT SOL

    Application/CharacteristicsAu-Ni alloy.Rack plating and jet plating.

    • Au conc.10g/L
    • Temp.42℃
    • pHSlightly acidic
    • Current Density*1~60A/dm2
    • Hardness150~180HV
    • Purity99.96~99.98%
  • OROBRIGHT GA

    Application/CharacteristicsAu-Ag alloy.Jet plating.

    • Au conc.15g/L
    • Temp.60℃
    • pHNeutral
    • Current Density*1~25A/dm2
    • Hardness95~110HV
    • Purity99.2~99.5%
  • OROBRIGHT BAR Series

    Application/CharacteristicsAu-Co alloy.Jet plating with Ni barrier.

    • Au conc.5g/L~
    • Temp.50℃
    • pHSlightly acidic
    • Current Density*10~60A/dm2
    • Hardness160~210HV
    • Purity99.70~99.98%
  • OROBRIGHT BAR(NI)Series

    Application/CharacteristicsAu-Ni alloy.Jet plating with Ni barrier.

    • Au conc.5g/L~
    • Temp.50℃
    • pHSlightly acidic
    • Current Density*10~60A/dm2
    • Hardness160~200HV
    • Purity99.70~99.98%
*Depends on Au concentration and agitation conditions.

Strike Gold and Flash Gold

ACID STRIKE is a strike gold plating formulation that enhances the adherence of plated coatings.
AFTER PLATE is a flash gold plating formulation for leadframe use.

  • ACID STRIKE

    Application/CharacteristicsStrike plating.Barrel plating and rack plating.

    • Au conc.1.0g/L
    • Temp.30℃
    • pHSlightly acidic
    • Current Density*1~5A/dm2
    • Purity99.99%
  • ACID STRIKE SS

    Application/CharacteristicsStrike plating on SUS surfaces.Rack plating.

    • Au conc.1.0g/L
    • Temp.32℃
    • pHAcidic
    • Current Density*(4~7V)
    • Purity99.99%
  • AFTER PLATE

    Application/CharacteristicsProven results for leadframe use.

    • Au conc.0.5g/L
    • Temp.50℃
    • pHNeutral
    • Current Density*0.05~0.10A/dm2
    • Purity99.99%
*Depends on Au concentration and agitation conditions.

Electroless Gold

IM-GOLD provides a pure gold coating with a dull surface finish.
The deposit shows high corrosion resistance and strong adherence suitable for soldering and wire bonding.

  • IM-GOLD IB

    Application/CharacteristicsImmersion gold plating on middle-P Ni surface. Suitable for soldering.

    • Au conc.2.0g/L
    • Temp.80℃
    • pHSlightly acidic
  • IM-GOLD IB2X

    Application/CharacteristicsImmersion gold plating on both high-P Ni and middle-P Ni surfaces. High corrosion resistance and excellent soldering property.

    • Au conc.1.2g/L
    • Temp.80℃
    • pHNeutral
  • IM-GOLD CN Series

    Application/CharacteristicsImmersion gold plating on middle-P Ni surfaces. Excellent soldering properties.

    • Au conc.1.0g/L
    • Temp.70℃
    • pHNeutral
  • IM-GOLD PC

    Application/CharacteristicsImmersion gold plating on Cu surfaces.Excellent soldering properties

    • Au conc.2.0g/L
    • Temp.85℃
    • pHNeutral
  • NEO GOLD Series

    Application/CharacteristicsNon-cyanide autocatalytic gold plating formulation with high stability.Suitable for soldering and wire bonding.

    • Au conc.2.0g/L
    • Temp.65℃
    • pHNeutral
*Depends on Au concentration and agitation conditions.