Gold plating｜JAPAN PURE CHEMICAL

TEMPERESIST Gold Plating Formulation (Electrolytic soft gold)

TEMPERESIST Series is high purity (99.99%) Au electrolytic plating formulation suitable for semiconductor applications. The deposited Au has a lemon-yellow appearance and shows excellent wire bondability with around Hv70 hardness. Combined with JPR 2001 (Cu removal resin), it contributes to cost reduction by extending plating formulation lifetime.

Cyanotype

Name of product	Applications and Characteristics	Au conc.	Liquid temp.	pH	Current Density^*	Hardness	Au Purity
TEMPERESIST EX	Abundant results for BGAs and CSPs. Au bump for COF/ACF connection.	8 g/L	65 °C	Neutral	0.2～0.6 A/dm²	60～80 HV	99.99%
TEMPERESIST FX	High-speed plating chemicals. Directly applicable on Cu surface. Abundant results for FPCs.	5 g/L	65 °C	Neutral	0.2～1.0 A/dm²	60～80 HV	99.99%
TEMPERESIST BL	Barrel plating. Applicable to pin plating for PGAs.	5 g/L	65 °C	Neutral	0.05～1.0 A/dm²	60～80 HV	99.99%
TEMPERESIST GR	Low erosion of resist; can be plated directly on Cu.	3 g/L	65 °C	Slight acidity	0.1～0.4 A/dm²	60～80 HV	99.99%
TEMPERESIST EX-H	Excellent film thickness uniformity	8 g/L	65 °C	Slight acidity	0.2～0.6 A/dm²	60～80 HV	99.99%

* Depends on Au Conc. and agitation conditions.

Cyanide-free type

Name of product	Applications and Characteristics	Au conc.	Liquid temp.	pH	Current Density^*	Hardness	Au Purity
TEMPERESIST K91 Series	Low stress gold coating. Suitable for semiconductor applications.	10 g/L	65 °C	Neutral	0.2～0.6 A/dm²	80～120 HV	99.99%

* Depends on Au Conc. and agitation conditions.

OROBRIGHT Gold Plating Formulation (electrolytic hard gold)

OROBRIGHT Series is electrolytic hard Au plating formulation, that is suitable for PCB, connector, contact and soldering applications. It enables low stress Au alloy plating layer with no cracks and peeling. The deposited Au alloy shows higher corrosion resistance, lower contact resistance, and excellent solder wettability.

Name of product	Applications and Characteristics	Au conc.	Liquid temp.	pH	Current Density^*	Hardness	Au Purity
OROBRIGHT HS2	Au-Co alloy. High throwing power. Rack plating.	2 g/L	42 °C	Slight acidity	0.5～3.0 A/dm²	180～210 HV	99.7～ 99.99%
OROBRIGHT HS5	Au-Co alloy. Submerged jet plating and Jet plating.	5 g/L	42 °C	Slight acidity	1～60 A/dm²	180～210 HV	99.7～ 99.99%
OROBRIGHT HS10	Au-Co alloy. Jet plating.	10 g/L	50 °C	Slight acidity	10～70 A/dm²	180～210 HV	99.7～ 99.99%
OROBRIGHT HSB Series	Au-Co alloy. Barrel plating.	2 g/L～	42 °C	Slight acidity	0.02～3.0 A/dm²	160～210 HV	99.7～ 99.99%
OROBRIGHT KS	Au-Co alloy. Low erosive to resist.	8 g/L	35 °C	Slight acidity	0.5～1.5 A/dm²	180～210 HV	99.7～ 99.99%
OROBRIGHT BAR Series	Au-Co alloy. Jet partial plating. Extensive achievements in Ni barrier and Au reduction.	5 g/L～	50 °C	Slight acidity	10～60 A/dm²	160～210 HV	99.7～99.9%
OROBRIGHT BAR (NI) Series	Au-Ni alloy. Rack plating and Jet partial plating. Extensive achievements in Ni barrier and Au reduction.	5 g/L～	50 °C	Slight acidity	10～60 A/dm²	160～200 HV	99.7～99.9%

* Depends on Au Conc. and agitation conditions.

Electrolytic Flash Gold Plating Formulation

ACID STRIKE is Au strike plating formulation, that enables excellent adhesion for Au plating on under metal layer.
AFTER PLATE is flash Au plating formulation for lead frame applications.

Name of product	Applications and Characteristics	Au conc.	Liquid temp.	pH	Current Density^*	Au Purity
ACID STRIKE	Strike plating. Barrel plating and Rack plating.	1.0 g/L	30 °C	Slight acidity	1～5 A/dm²	99.99%
ACID STRIKE SS	Strike plating on SUS surface. Rack plating.	1.0 g/L	32 °C	Acidic	(4～7 V)	99.99%
AFTER PLATE	Abundant results for lead frames.	0.5 g/L	50 °C	Neutral	0.05～0.10 A/dm²	99.99%

* Depends on Au Conc. and agitation conditions.

Electroless Gold Plating Formulation (Immersion gold/Reduction gold)

IM-GOLD and NEO GOLD Series provide a matte pure Au plating deposition layer with excellent adhesion. The deposited Au shows excellent corrosion resistance, wire bondability, and solder wettability.

Name of product	Applications and Characteristics	Au conc.	Liquid temp.	pH
IM-GOLD IB	Immersion gold plating on middle-P Ni surface. Suitable for soldering.	2.0 g/L	80 °C	Slight acidity
IM-GOLD IB2X	Immersion gold plating on both high-P Ni and middle-P Ni surfaces. High corrosion resistance and excellent soldering property.	1.2 g/L	80 °C	Neutral
IM-GOLD CN Series	Immersion gold plating on middle-P Ni surface. Excellent soldering property.	1.0 g/L	70 °C	Neutral
IM-GOLD PC	Immersion gold plating on Cu surface. Excellent soldering property.	2.0 g/L	85 °C	Neutral
NEO GOLD Series	Non-cyanide Reduction gold plating chemicals with high stability. Suitable for soldering and wire bonding.	2.0 g/L	65 °C	Neutral
HY-GOLD CN Series	Immersion-Reduction type gold plating on Pd deposition. Applicable to EPIG process for both wire bonding and soldering uses.	0.5 g/L	81 °C	Neutral
HY-GOLD IS Series	Non-cyanide Immersion-Reduction type gold plating on Pd deposition. Applicable to ENEPIG process for both wire bonding and soldering uses.	1.0 g/L	70 °C	Neutral