Silver Plating, etc.

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Electrolytic Silver Plating Formulation

TEMPERESIST AGR and SELENABRIGHT Series are high purity Ag plating formulation with high-speed deposition rate. The deposited Ag has wide color tone from dull-white to bright and shows excellent wire bondability and solder wettability.

Name of
product		 Applications and
Characteristics		 Ag
conc.		 Liquid
temp.		 pH Current
Density*		 Hardness Brightness
TEMPERESIST AGR Series Lead frame use. 60 g/L 60 °C Neutral 10～220 A/dm2 80～100 HV dull ~ 1.0 or more
SELENABRIGHT N50 SELENABRIGHT N50 50 g/L 40 °C Neutral 5～12 A/dm2 80～100 HV 0.2～0.8
SELENABRIGHT C Rack plating and Hoop plating.
Cyanide type. 		50 g/L 40 °C Alkaline 10～40 A/dm2 80～130 HV 0.2～0.8

* Depends on Ag conc. and agitation conditions.

Electroless Silver Plating Formulation

Cyanide-free bath for immersion Ag plating on Cu.

Name of
product		 Applications and
Characteristics		 Ag
conc.		 Liquid
temp.		 pH
IM-SILVER TK Suitable for soldering as alternation of solder leveling or Ni/Au plating processes. 1 g/L 45 °C Neutral
Anti Bacterial Agent

Anti bacterial agent suppresses generation of microorganisms with no effect on plating performance by adding to plating tanks and drag-out tanks.

Name of product Applications and Characteristics
MFP ANTI BACTERIAL AGENT Series Suppresses growth of microorganisms.
Applicable plating chemicals are limited.
Impurity Removal

JPR 2001 selectively removes Cu impurity ions dissolved in Au and Pd plating formulation.
It is reusable by desorbing absorbed Cu impurity ions.
UPT065 is activate carbon filter with special pore fibers for purifying plating formulation.

Name of product Target Impurity Applicable plating Formulation
JPR 2001 Cu TEMPERESIST (EX, FX, BL, GR, EX-H), PALLABRIGHT (SST, SST-L, NANO2), etc.
ACTIVATED CARBON FILTER UPT065 Organic Impurities TEMPERESIST (EX, FX, BL, EX-H), PALLABRIGHT (SST, SST-L), OROBRIGHT BAR Series.
Surface treatment agents other than plating Formulation
Name of product Applications and Characteristics
PREDIP T99
PREDIP AGR（C） 		Immersion inhibitor on Cu and Ni surfaces. Inhibits surface oxidation and sulfidation and maintains activated surface to afford excellent adherence.
COPPER PROTECTOR T45 Anti discoloration agent of Cu surface with excellent heat resistance.
Used after electrolytic stripping of Ag coating on lead frames.
AQUA PRECOAT Water-soluble sealing agent. Applicable to Au and Ag surfaces. Improves corrosion resistance.
Gold, Silver, Palladium STRIPPER

STRIPPER is high-speed stripping agent usable at room temperature.

Name of
product		 Applications and
Characteristics		 Stripped
metal		 pH Current
Density
STRIPPER GOLD High-speed immersion Au STRIPPER with cyanide. Au Alkaline -
STRIPPER PALLADIUM Immersion Pd STRIPPER with cyanide. Pd Alkaline -
SUPER STRIPPER C High-speed immersion Ag and Cu STRIPPER with cyanide. Ag,Cu Alkaline -
SILVER STRIPPER
D23SS Series 		Non-cyanide electrolytic Ag STRIPPER. Ag Slightly alkaline 0.2～3.9 A/dm2