Electrolytic Silver

The TEMPERESIST AGR and SELENABRIGHT Series are high-speed silver plating formulations that provide pure silver coatings.
The electrodeposit has a wide color tone from dull-white to bright and shows excellent wire bonding and soldering properties.

  • TEMPERESIST AGR Series

    Application/CharacteristicsLeadframe use

    • Ag conc.60g/L
    • Temp.60℃
    • pHNeutral
    • Current Density*10～220A/dm2
    • Hardness80～100HV
    • Brightnessdull～1.0以上

  • SELENABRIGHT N50

    Application/CharacteristicsRack plating.Low cyanide.

    • Ag conc.50g/L
    • Temp.40℃
    • pHNeutral
    • Current Density*5～12A/dm2
    • Hardness80～100HV
    • Brightness0.5～0.8以上

  • SELENABRIGHT C

    Application/CharacteristicsRack plating and hoop plating.Cyanide type.

    • Ag conc.50g/L
    • Temp.40℃
    • pHAlkaline
    • Current Density*10～40A/dm2
    • Hardness80～130HV
    • Brightness0.5～0.8以上
*Depends on Ag concentration and agitation conditions.

Electrless Silver

IM-SILVER is a non-cyanide immersion silver plating formulation on Cu surfaces.

  • IM-SILVER TK

    Application/CharacteristicsSuitable for soldering as alternation of solder leveling or Ni/Au plating processes.

    • Ag conc.1g/L
    • Temp.45℃
    • pHNeutral

Anti Bacterial Agent

Applicable to plating tanks and drag-out tanks. Suppresses growth of microorganisms without sacrificing plating performance.

  • MFP Anti Bacterial Agent Series

    Application/CharacteristicsSuppresses growth of microorganisms. Applicable plating chemicals are limited.

Impurity Removal

JPR 2001 is a Cu removal resin that selectively removes Cu ions dissolved in Au and Pd bath solutions. JPR 2001 can be reused by desorbing absorbed Cu ions. FINEGARD is an activated carbon filter applicable to JPC plating chemicals.

  • JPR2001

    Applicable Plating Chemicals TEMPERESIST (EX, FX, BL), PALLABRIGHT (SST, SST-L, NANO2), OROBRIGHT, etc.

    • Target ImpurityCu

  • AC CARTRIDGE FILTER UPT065

    Applicable Plating ChemicalsTEMPERESIST (EX, FX, BL), PALLABRIGHT (SST, SST-L), OROBRIGHT BAR Series.

    • Target ImpurityOrganic Impurities

Other Surface Treatment Chemicals

  • PREDIP T99

    Application/CharacteristicsImmersion inhibitor on Cu and Ni surfaces. Inhibits surface oxidation and sulfidation and maintains activated surfaces for excellent adherence.

  • PREDIP AGR（C）

    Application/CharacteristicsImmersion inhibitor on Cu and Ni surfaces. Inhibits surface oxidation and sulfidation and maintains activated surfaces for excellent adherence.

  • COPPER PROTECTOR T45

    Application/CharacteristicsAnti discoloration agent for Cu surfaces and has excellent heat resistance. Used after electrolytic stripping of Ag coating on leadframes.

  • AQUA PRECOAT

    Application/CharacteristicsWater-soluble sealing agent. Applicable to Au and Ag surfaces. Improves corrosion resistance.

Stripping Agent

STRIPPER is a high-speed stripping agent usable at room temperature.

  • STRIPPER GOLD

    Application/CharacteristicsHigh-speed immersion Au stripper with cyanide.

    • TypeAu
    • pHAlkaline
    • Current Density-

  • STRIPPER PALLADIUM

    Application/CharacteristicsImmersion Pd stripper with cyanide.

    • TypePd
    • pHAlkaline
    • Current Density-

  • SUPER STRIPPER

    Application/CharacteristicsHigh-speed immersion Ag and Cu stripper with cyanide.

    • TypeAg,Cu
    • pHAlkaline
    • Current Density-

  • SILVER STRIPPER D23SS Series

    Application/CharacteristicsNon-cyanide electrolytic Ag stripper.

    • TypeAg
    • pHSlightly Alkaline
    • Current Density0.2～3.9A/dm2