Electrolytic Palladium

PALLABRIGHT is a palladium electroplating formulation for connector, leadframe and decorative uses.
Applicable to Ni/Pd/Au processes aimed at Au reduction on wire bonding pads.

  • PALLABRIGHT SSS-B

    Application/CharacteristicsDecorative uses.Specular bright surfaces. Crack resistance with Pd plating of 1 μm or more.

    • Pd conc.15g/L
    • Temp.50℃
    • pHNeutral
    • Current Density*1～3A/dm2
    • Hardness230～280HV
    • Purity99.99%

  • PALLABRIGHT SST

    Application/CharacteristicsBonding wire use. Semi-bright surface.

    • Pd conc.10g/L
    • Temp.60℃
    • pHNeutral
    • Current Density*0.5～5.0A/dm2
    • Hardness200～250HV
    • Purity99.99%

  • PALLABRIGHT SST-L

    Application/CharacteristicsLeadframe use. Semi-bright surfaces. Suitable for soldering and wire bonding.

    • Pd conc.5g/L
    • Temp.60℃
    • pHNeutral
    • Current Density*0.5～3.0A/dm2
    • Hardness200～250HV
    • Purity99.99%

  • PALLABRIGHT NANO2

    Application/CharacteristicsLeadframe use.Ultrathin applications.

    • Pd conc.3g/L
    • Temp.50℃
    • pHNeutral
    • Current Density*0.2～2.0A/dm2
    • Hardness200～250HV
    • Purity99.99%

  • PALLABRIGHT 2000

    Application/CharacteristicsHigh-speed Pd-Ni plating formulation with low ammonia content.

    • Pd conc.20g/L
    • Temp.45℃
    • pHNeutral
    • Current Density*1～60A/dm2
    • Hardness330～400HV
    • Purity80%以上
*Depends on Pd concentration and agitation conditions.

Electroless Palladium

The NEO PALLABRIGHT Series is an electroless palladium plating formulation applicable to ENEPIG processes for both wire bonding and soldering uses.

  • NEO PALLABRIGHT Series

    Application/CharacteristicsElectroless Pd plating on electroless Ni surfaces.Pure Pd plating formulation with high stability.

    • Pd conc.1.0g/L
    • Temp.72℃
    • pHNeutral
    • Purity99.9%以上
*Depends on Pd concentration and agitation conditions.