Palladium plating

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PALLABRIGHT Palladium Plating Formulation(Electrolytic Palladium) ）

PALLABRIGHT Series is electrolytic Pd plating formulation, that is suitable for connector and lead frame applications. Applicable to Ni/Pd/Au plating process on manufacturing wire bonding pads for the purpose of Au saving.

Name of
product		 Applications and
Characteristics		 Pd
conc.		 Liquid
temp.		 pH Current
Density*		 Hardness Pd
purity
PALLABRIGHT SST Bonding wire use. Semi-bright surface. 10 g/L 60 ℃ Neutral 0.5～5.0 A/dm2 200～250 HV 99.99%
PALLABRIGHT SST-L Lead frame use. Semi-bright surface.
Suitable for soldering and wire bonding. 		5 g/L 60 ℃ Neutral 0.5～3.0 A/dm2 200～250 HV 99.99%
PALLABRIGHT NANO2 Lead frame use. Ultrathin application. 3 g/L 50 ℃ Neutral 0.2～2.0 A/dm2 200～250 HV 99.99%
PALLABRIGHT 2000 High-speed Pd-Ni plating chemicals with low ammonia content. 20 g/L 45 ℃ Neutral 1～60 A/dm2 470～530 HV 80%以上

* Depends on Pd concentration and agitation conditions.

NeoPALLABRIGHT Palladium Plating Formulation (Electroless Palladium)

NEO PALLABRIGHT Series is autocatalytic Pd plating formulation, that is suitable for ENEPIG/ EPIG processes. The deposited Pd has both excellent wire bondability and solder wettability.

Name of
product		 Applications and
Characteristics		 Pd
conc.		 Liquid
temp.		 pH Pd
purity
NEO PALLABRIGHT Series Electroless Pd plating on electroless Ni. Pure Pd plating chemicals with high stability. 1.0 g/L 72 ℃ Neutral 99.99%
NEO PALLABRIGHT DP Series Direct Pure Palladium plating on Cu surface. Inhibits void generation in Cu interface for excellent soldering properties. 1.0 g/L 50 ℃ Slight acidity 99.99%以上

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