JPC Technical Journal

HOMETechnology and R&DJPC Technical Journal

JPC Technical Journal

Lecture

Year Title. Speaker academic conference
2023 Ni-free surface finish for high-frequency module substrates Masato Kobayashi IMPACT 2023
2023 Electroless Au Plating Solution Today and Tomorrow Kenji Yoshiba Kanagawa Surface Technology Research Association
2014 Introduction of new ENEPIG processes Yusuke Nakagawa JPCA Show 2014
2014 Cyanide-free gold plating solution for ENEPIG Kanzo Kiyohara 2014 Japan Institute of Electronics Packaging
2012 Low gold concentration plating bath using Protecting Agent Kenji Yoshiba The 26th Japan Institute of Electronics Packaging Conference, Monozukuri Session
2011 Using the "Protecting Agent The Latest in Precious Metal Plating Technology Kanzo Kiyohara JPCA Show 2011
2004 Electroless Direct Substitution Gold Plating Kenji Yoshiba The 41st Annual Conference of the Japan Society of Electronic Materials and Technology

Academic Paper

Title. Author Academic Journal
Year 2020 Hard gold plating for connectors Kazuya Shibata, Tsugutaka Toma Science and Engineering of Materials, Vol. 57, No. 6
2019 Recent electronic devices and plating Masahiro Igawa Surface Technology, Vol. 70, No. 9
2013 Latest gold plating technology "Protecting Agent" for semiconductor packages Ryuji Takasaki, Kanzo Kiyohara, Kenji Yoshiba JETI, Vol. 61, No.10