Upcoming Events

Event and Exhibition Information

ELECTRONICA CHINA 2024

Holding period	Monday, July 8 - Wednesday, July 10, 2024
Venue	Shanghai New International Expo Centre (Booth No. N4.4123)
Exhibiting company (at a trade show, etc.)	Kanematsu (China) (exhibited jointly with our distributor in China)
Exhibit Details	Plating technology for Connectors is introduced here.

SEMICON CHINA 2024

Holding period	Wednesday, March 20, 2024 - Friday, March 22, 2024
Venue	Shanghai New International Expo Centre (Booth No. T1313)
Exhibiting company (at a trade show, etc.)	Kanematsu (China) (exhibited jointly with our distributor in China)
Exhibit Details	Plating technologies for micro bumps and RDL(Re-Distribution Layer), and cyanide-free Au plating technology for compound Semiconductors are introduced.

BATTERY JAPAN2024～ 16th Int'l Rechargeable Battery Expo

Holding period	February 28, 2024 (Wednesday) - March 1, 2024 (Friday)
Venue	Tokyo Big Sight, East Hall 4 (Booth No. E27-19)
Exhibit Details	We have been developing our business by specializing in noble metal plating chemicals used for contacts of electronic components, and we will introduce the development of battery materials, a new field we have started working on by applying the oxidation-reduction technology we have cultivated in the plating business.

38th NEPCON JAPAN - Electronics Development & Packaging Expo

Holding period	Wednesday, January 24, 2024 - Friday, January 26, 2024
Venue	Tokyo Big Sight, East Hall 4 (Booth No. E32-38)
Exhibit Details	We will introduce cost reduction through gold saving of Connectors and the most advanced Ni-free process. We will also introduce new products under development and the development of battery materials that apply the oxidation-reduction technology we have cultivated in the plating industry.