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Corporate Philosophy and Vision
Value Creation Story
Medium-term Management Forecast
Top Message
Corporate summary
Business summary
Board of Directors and Executive Officers
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History
Basic Policy and Structure
JPC Technical Journal
Main Facilities and Equipment
Gold plating
Palladium plating
Silver Plating, etc.
Quality Assurance System Product Supply System
Upcoming Events
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To Our Investors
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5G-ready nickel-free plating technology
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JPC Technical Journal
5G-ready nickel-free plating technology
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Electroless Direct Au plating on Cu (DIG)
Electroless direct Pd/Au plating on Cu (EPIG)
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