本システムでは、JavaScriptを利用しています。JavaScriptを有効に設定してからご利用ください。
本文へ
Standard
Large
Extra Large
Language
日本語
English
简体中文
繁體中文
한국어
Contact
News
JPC's Value
Corporate Philosophy and Vision
Value Creation Story
Medium-term Management Forecast
Corporate Information
Top Message
Corporate summary
Access
Business summary
Board of Directors and Executive Officers
Organizational structure
History
Technology, R & D
Basic Policy and Structure
JPC Technical Journal
Main Facilities and Equipment
3GeV high-brilliance synchrotron radiation facility "Nano Terasu
Product Information
Gold plating
Palladium plating
Silver Plating, etc.
Quality Assurance System Product Supply System
Upcoming Events
Inquiry Form
Sustainability
Top Message
Sustainability Management
Sustainability Policy and Structure
Materiality
Sustainability Initiatives
Environment
Society
Governance
Corporate Governance
Investor Relations
IR News
To Our Investors
JPC’s Business and Electronic Components
JPC's Business (Strengths and Share)
Glossary
Frequently Asked Questions
Management Policy and Strategy
Top Message
Disclosure Policy
IR Calendar
Business Performance and Finances
Business Performance Highlights
IR Materials
Financial Statements
Financial Results presentation material
Investor's Guide
Stock Information
Basic Stock Information
Shareholder Return
Disclaimer
News
Contact us
Privacy Policy
Site Policy
Site Map
Corporate Philosophy and Vision
Value Creation Story
Medium-term Management Forecast
Top Message
Corporate summary
Business summary
Board of Directors and Executive Officers
Organizational structure
History
Basic Policy and Structure
JPC Technical Journal
Main Facilities and Equipment
Gold plating
Palladium plating
Silver Plating, etc.
Quality Assurance System Product Supply System
Upcoming Events
Inquiry Form
Top Message
Sustainability Management
Environment
Society
Governance
IR News
To Our Investors
Management Policy and Strategy
IR Calendar
Business Performance and Finances
IR Materials
Stock Information
Disclaimer
Electroless gold plating technology for high-density packages
HOME
Technology, R & D
JPC Technical Journal
Electroless gold plating technology for high-density packages
Print
Electroless Ni/Pd/Au plating (ENEPIG)
view list