Gold Plating Technology for Semiconductor Wiring

Feature

• Excellent thickness uniformity (Especially when different wiring widths are mixed)
• Excellent wiring top flatness
• Excellent via-hole formability (Deposition characteristic controllable)
• Available to reduced surface roughness
• Reduced damage to resists
• Low plating temperature

Application example

Example of Electrolytic Au Plating Wiring Fabrication

Example of Excellent Au Plating Thickness Uniformity

Example of Reduced Surface Roughness

Example of Excellent Via-Hole Formability